Descripción
Frequency 3200 MHz
Turbo frequency 3600 MHz
Bus speed 8 GT/s DMI
Clock multiplier 32
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151
Architecture / Microarchitecture
Microarchitecture Skylake
Processor core Skylake-S
Core stepping R0 (SR2BX)
Manufacturing process 0.014 micron
Data width 64 bit
The number of cores 4
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size 4 x 256 KB caches
Level 3 cache size 6 MB shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features
MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / Intel 64
NX / XD / Execute disable bit
VT-x / Virtualization technology
VT-d / Virtualization for directed I/O
TBT 2.0 / Turbo Boost technology 2.0
TXT / Trusted Execution technology
TSX / Transactional Synchronization Extensions
Low power features Enhanced SpeedStep technology
Integrated peripherals / components
Integrated graphics
GPU Type: HD 530
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
The number of supported displays: 3
Memory controller
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)
Electrical / Thermal parameters
Thermal Design Power 65 Watt
